{"version":"1.0","provider_name":"OMRON SENTECH CO., LTD.","provider_url":"https:\/\/sentech.co.jp\/en","author_name":"omron","author_url":"https:\/\/sentech.co.jp\/en\/author\/omron","title":"High-Precision Detection of Soldering Defects and Component Misalignment \u2013 Case Study of PCB Assembly Inspection | Case Study | OMRON SENTECH CO., LTD.","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"bABVSm6S5M\"><a href=\"https:\/\/sentech.co.jp\/en\/case-study\/case-study-11867\">High-Precision Detection of Soldering Defects and Component Misalignment \u2013 Case Study of PCB Assembly Inspection<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/sentech.co.jp\/en\/case-study\/case-study-11867\/embed#?secret=bABVSm6S5M\" width=\"600\" height=\"338\" title=\"&#8220;High-Precision Detection of Soldering Defects and Component Misalignment \u2013 Case Study of PCB Assembly Inspection&#8221; &#8212; OMRON SENTECH CO., LTD.\" data-secret=\"bABVSm6S5M\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/sentech.co.jp\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/sentech.co.jp\/wp-content\/uploads\/2025\/09\/IMG_Appli_Electro-parts_PNG_127.png","thumbnail_width":567,"thumbnail_height":425,"description":"n the PCB assembly process, which directly affects the reliability of electronic devices, it is essential to reliably detect even minute solder cracks, lifted components, or misaligned placements. OMRON SENTECH industrial cameras, equipped with high-resolution CMOS sensors and global shutter technology, capture fine details with clarity. They also support high-speed interfaces such as GigE Vision [&hellip;]"}