Company InformationCompany History
2025
- Developed and manufactured 5M 3CMOS sensor camera
- Developed and manufactured GVIF cameras
- Toshioki Ikehara is appointed CEO
2024
- Developed and manufactured liquid lens integrated USB3 Vision cameras
- Developed and manufactured 67M CoaXPress (CXP-12) cameras
2023
- Developed and manufactured small form factor Full HD UVC cameras
2022
- Developed and manufactured SWIR cameras
- Developed and manufactured CoaXPress (CXP-12) cameras
- Developed and manufactured small form factor USB3 Vision cameras
2021
- Developed and manufactured GigE Vision board cameras
- Developed and manufactured USB3 Vision camera with polarization image sensor
2020
- Takashi Kamei is appointed CEO
- Sales office in Kyoto relocation to Simogyo-ku, kyoto-city
- Developed and manufactured GigE Vision Line Cameras
- Developed and manufactured Opt-C:Link (40G) cameras
2018
- Developed and manufactured small form facture GigE Vision Series
- Developed and manufactured small board cameras (UVC/MIPI)
2017
- Head quarters relocation to Ebina, Kanagawa
- Conclusion of business transfer agreement with OMRON Corporation
- and has become OMRON’s 100% subsidiary company as OMRON SENTECH CO., LTD.
- Developed and manufactured small board cameras (NTSC/PAL)
- Awarded Excellence Prize for The 21th Environment Communication Awards
2016
- Awarded Excellence Prize for The 20th Environment Communication Awards
2015
- Established Sentech Holding Co., Ltd.
- Developed and manufactured SONY CMOS high speed USB3 Series
- Developed and manufactured SONY CMOS high speed GigE Series
- Developed and manufactured 12MP CMOS high speed CoaXPress (CXP-6) camera
- Developed and manufactured 12MP CMOS high speedOptCLink camera
2014
- Company name changed from Sensor Technology Co., Ltd. to Sentech Co., Ltd.
2012
- Established sales office in Kyoto
- Developed 28mm x 28mm compact USB 2.0 output camera
- Developed 1280 x 720P SDI (HD-SDI connector) output high-vision color camera
- Established sales company Sentech Technologies Europe in Frankfurt, Germany
- Developed and PoE GigE Vision cameras
- Developed 1920 x 1080P DVI (HDMI connector) output high-vision color camera
- Developed and manufactured USB3 Vision cameras
2011
- Developed and manufactured 1280 x 720P DVI (HDMI connector) output high-vision color camera
- Established sales company Sentech Singapore in Singapore
2010
- Established sales company Sentech Hong Kong (Chinese office in Shenzhen, China)
2009
- Developed and manufactured 1.3MP HD (720 p) output AF color camera
2008
- Developed and manufactured 28mm x 28mm-size compact Camera Link camera PoCL series
- Developed and manufactured C-MOS endoscopic USB camera industrial use with Φ6mm/Φ4.5mm head component
2007
- Established sales company Sentech Hong Kong (Chinese office in Shenzhen, China)
2006
- Developed and manufactured UXGA compact progressive camera
2005
- Developed and manufactured USB 2.0 VGA and XGA color camera
- Developed and manufactured 28mm x 28mm compact progressive camera series
2004
- Established sales company Taiwan Sentech in Taipei
2003
- Developed megapixel camera link black and white camera
2002
- Developed and manufactured color camera for book magnifier
2000
- Developed and manufactured progressive double-speed scanning camera
1999
- Established sales company Sensor Technologies America in Dallas in a bid to expand sales of video cameras to the U.S.
1996
- Head quarters relocated to Nakacho, Atsugi, Kanagawa Prefecture
- Increased paid-up capital to 45 million yen
1995
- Developed and manufactured CCD/DSP color camera
1989
- Developed and manufactured CCD color camera
1988
- Developed and manufactured line sensor
Developed and manufactured CMOS color camera - Developed and manufactured black and white CCD camera
1987
- Established and commenced operations with 30 million yen in paid-up capital in Hongo 3-chome, Bunkyo-ku, Tokyo
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Sales Department+81 46236-6660
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