Corporate History

1987 Established and commenced operations with 30 million yen in paid-up capital in Hongo 3-chome, Bunkyo-ku, Tokyo
1988 Developed and manufactured line sensor
Developed and manufactured CMOS color camera
Developed and manufactured black and white CCD camera
1989 Developed and manufactured CCD color camera
1995 Developed and manufactured CCD/DSP color camera
1996 Relocated to Nakacho, Atsugi, Kanagawa Prefecture
Increased paid-up capital to 45 million yen
1999 Established sales company Sensor Technologies America in Dallas in a bid to expand sales of video cameras to the U.S.
2000 Developed and manufactured progressive double-speed scanning camera
Developed and manufactured color camera for book magnifier
2002 Developed and manufactured compact color head separation camera
2003 Developed megapixel camera link black and white camera
2004 Established sales company Taiwan Sentech in Taipei
2005 Developed and manufactured USB 2.0 VGA and XGA color camera
Developed and manufactured 28mm x 28mm ultra-compact progressive camera series
2006 Developed and manufactured UXGA ultra-compact progressive camera
2007 Established sales company Sentech Hong Kong (Chinese office in Shenzhen, China)
2008 Developed and manufactured 28mm x 28mm-size ultra-compact Camera Link camera PoCL series
Developed and manufactured C-MOS endoscopic USB camera industrial use with Φ6mm/Φ4.5mm head component
Developed 5 megapixel ultra-compact Camera Link camera with color and black and white lineup
2009 Developed and manufactured 1.3 megapixel HD (720 p) output AF color camera
2010 Relocated Sentech Hong Kong and Chinese office to from Shenzhen to Shanghai
Developed and manufactured GigE Vision® camera (2.0 megapixels)
2011 Developed and manufactured GigE Vision® camera (5.0 megapixels)
Developed 1280 x 720P DVI (HDMI connector) output high-vision color camera
Established sales company Sentech Singapore in Singapore
2012 Established sales office in Kyoto
Developed 28mm x 28mm compact USB 2.0 output camera
Developed 1280 x 720P SDI (HD-SDI connector) output high-vision color camera
Developed high-speed high frame rate 2 megapixel/4 megapixel CMOS Camera Link camera
Developed and manufactured 28mm x 28mm USB 3.0 5 megapixel CMOS camera
Established sales company Sentech Technologies Europe in Frankfurt, Germany
2013 PoE Series newly released
Developed 1920 x 1080P DVI (HDMI connector) output high-vision color camera
Developed and manufactured 28mm x 28mm USB 3.0 1.3 megapixel CMOS camera
Certification・Registration of Eco Action21
2014 Developed and manufactured 12M CMOS high speed Camera Link camera
Company name changed from Sensor Technology Co., Ltd. to Sentech Co., Ltd.
Developed and manufactured 2M, 4M CMOS high speed GigE(PoE) camera
Established sales company Sentech Korea in South Korea
2015 Developed and manufactured SONY 2.3M CMOS USB3 Vision camera
Established Sentech Holding Co., Ltd.
Developed and manufactured 3M, 5M SONY CMOS high speed USB3 Vision/GigE camera
Developed and manufactured 12M CMOS high speed CoaX, OptCLink camera
2016 Developed and manufactured SONY CMOS high speed Camera Link Series
Developed and manufactured SONY CMOS high speed GigE Series
Developed and manufactured SONY CMOS high speed USB3 Series
Awarded Excellence Prize for The 20th Environment Communication Awards
2017 HQ Relocation to Ebina, Kanagawa
Conclusion of business transfer agreement with Omron Corporation, and has become OMRON's 100% subsidiary company as 『OMRON SENTECH CO., LTD. 』
Choosing a Camera
  • Software Downloads
  • Document Downloads
  • FAQ
pagetop