1987 | Established and commenced operations with 30 million yen in paid-up capital in Hongo 3-chome, Bunkyo-ku, Tokyo |
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1988 | Developed and manufactured line sensor Developed and manufactured CMOS color camera Developed and manufactured black and white CCD camera |
1989 | Developed and manufactured CCD color camera |
1995 | Developed and manufactured CCD/DSP color camera |
1996 | Relocated to Nakacho, Atsugi, Kanagawa Prefecture Increased paid-up capital to 45 million yen |
1999 | Established sales company Sensor Technologies America in Dallas in a bid to expand sales of video cameras to the U.S. |
2000 | Developed and manufactured progressive double-speed scanning camera Developed and manufactured color camera for book magnifier |
2002 | Developed and manufactured compact color head separation camera |
2003 | Developed megapixel camera link black and white camera |
2004 | Established sales company Taiwan Sentech in Taipei |
2005 | Developed and manufactured USB 2.0 VGA and XGA color camera Developed and manufactured 28mm x 28mm ultra-compact progressive camera series |
2006 | Developed and manufactured UXGA ultra-compact progressive camera |
2007 | Established sales company Sentech Hong Kong (Chinese office in Shenzhen, China) |
2008 | Developed and manufactured 28mm x 28mm-size ultra-compact Camera Link camera PoCL series Developed and manufactured C-MOS endoscopic USB camera industrial use with Φ6mm/Φ4.5mm head component Developed 5 megapixel ultra-compact Camera Link camera with color and black and white lineup |
2009 | Developed and manufactured 1.3 megapixel HD (720 p) output AF color camera |
2010 | Relocated Sentech Hong Kong and Chinese office to from Shenzhen to Shanghai Developed and manufactured GigE Vision® camera (2.0 megapixels) |
2011 | Developed and manufactured GigE Vision® camera (5.0 megapixels) Developed 1280 x 720P DVI (HDMI connector) output high-vision color camera Established sales company Sentech Singapore in Singapore |
2012 | Established sales office in Kyoto Developed 28mm x 28mm compact USB 2.0 output camera Developed 1280 x 720P SDI (HD-SDI connector) output high-vision color camera Developed high-speed high frame rate 2 megapixel/4 megapixel CMOS Camera Link camera Developed and manufactured 28mm x 28mm USB 3.0 5 megapixel CMOS camera Established sales company Sentech Technologies Europe in Frankfurt, Germany |
2013 | PoE Series newly released Developed 1920 x 1080P DVI (HDMI connector) output high-vision color camera Developed and manufactured 28mm x 28mm USB 3.0 1.3 megapixel CMOS camera Certification・Registration of Eco Action21 |
2014 | Developed and manufactured 12M CMOS high speed Camera Link camera Company name changed from Sensor Technology Co., Ltd. to Sentech Co., Ltd. Developed and manufactured 2M, 4M CMOS high speed GigE(PoE) camera Established sales company Sentech Korea in South Korea |
2015 | Developed and manufactured SONY 2.3M CMOS USB3 Vision camera Established Sentech Holding Co., Ltd. Developed and manufactured 3M, 5M SONY CMOS high speed USB3 Vision/GigE camera Developed and manufactured 12M CMOS high speed CoaX, OptCLink camera |
2016 | Developed and manufactured SONY CMOS high speed Camera Link Series Developed and manufactured SONY CMOS high speed GigE Series Developed and manufactured SONY CMOS high speed USB3 Series Awarded Excellence Prize for The 20th Environment Communication Awards |
2017 | HQ Relocation to Ebina, Kanagawa Conclusion of business transfer agreement with Omron Corporation, and has become OMRON's 100% subsidiary company as 『OMRON SENTECH CO., LTD. 』 |