High-Precision Detection of Fine Terminal Defects – Case Study of Connector Terminal Inspection

In connector terminals, which directly affect the reliability of electronic devices, even minor defects such as bending, chipping, foreign material adhesion, or plating defects cannot be overlooked. On mass production lines, highly accurate and stable inspection is required.
OMRON SENTECH industrial cameras, equipped with high-resolution CMOS sensors and global shutter technology, capture sharp images without blur to detect fine details. In addition, with support for high-speed interfaces such as USB3 Vision and CoaXPress, they enable real-time inspection that keeps pace with production line speeds.
With this implementation, early detection of terminal defects and reduction of defective outflow are achieved, contributing to enhanced quality assurance in the inspection process of electronic components and improved manufacturing efficiency.
(Image processing may be required for defect detection.)
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